Formlabs High Temp Resin is a heat-resistant photopolymer resin for the Form 4, engineered to maintain its shape and mechanical integrity at elevated temperatures. With a heat deflection temperature (HDT) of up to 238 C at 0.45 MPa after full post-cure, it is one of the most thermally stable resins available for desktop SLA printing.

High Temp Resin is designed for applications where standard engineering resins would warp or soften under heat. Molds for low-run injection molding or thermoforming, housings mounted near motors, electronics or heat sources, and test fixtures used in thermal cycling environments all benefit from its exceptional thermal stability. It is also commonly used for casting masters and sacrificial tooling that must survive elevated process temperatures.

Key features

• Heat deflection temperature up to 238 C at 0.45 MPa after full post-cure, among the highest for desktop SLA resins.
• Maintains dimensional integrity under sustained thermal load, preventing warping and softening.
• Suitable for low-run injection molding masters, thermoforming bucks and tooling inserts.
• Ideal for electronics housings, motor mounts and components positioned near heat-generating parts.
• Good surface hardness and stiffness at room temperature for precision test fixtures.
• Formulated for the Form 4 MSLA light engine for reliable, repeatable high-quality prints.

Compatible with: Formlabs Form 4